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- Stay Clean® paste soldering flux was designed primarily for copper-to-copper and copper-to-brass connection. In its paste form it is ideal for soldering tube joints. It is not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. This flux works well with most leaded and lead-free solder compositions. The flux residue should be removed after soldering.
Harris® Solder Flux, General Purpose, Series: Stay Clean®, 1 lb, Jar, Paste, Composition: 2 to 15 % Ethylene Glycol , 1 to 10 % Ammonium Chloride, 5 to 30 % Zinc Chloride, 30 to 80 % Petrolatum and 1 to 10 % Water, Odorless, Up to 600 deg F, 1.11 Specific Gravity, Applicable Materials: Brass, Bronze, Copper, Copper to Copper, Copper to Brass, Galvanized Steel and Steel
- Superior paste soldering flux for most metals except aluminum, magnesium or titanium
- Designed for copper-to-copper and copper-to-brass connections as well as copper, brass, bronze, steel, galvanized steel and Monel®
- Ideal for soldering tube joints
- Works well with most leaded and lead-free solder compositions
- Due to the corrosive nature of the flux residue, this product is not recommended for use in electrical or electronic applications
- Capacity1 lbContainer TypeJarFormPasteManufacturerThe Lincoln Electric CompanyManufacturer #SCPF1Odor / ScentOdorlessSeriesStay Clean®Specific Gravity1.11Temperature RatingUp to 600 degFTypeGeneral Purpose